| 摘要 |
PROBLEM TO BE SOLVED: To improve wiring properties in a board wherein a package sealing semiconductor chips is mounted. SOLUTION: The semiconductor chip 1 includes a plurality of hard macros 2 which operate by a reference clock CLK and a pad PAD-CLK for clock which supplies the reference clock CLK to one hard macro 2A among the hard macros 2 from the outside. The reference clock CLK to be supplied to one hard macro A is relayed to hard macros 2B-2D other than the hard macros 2 in order. COPYRIGHT: (C)2007,JPO&INPIT
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