| 摘要 |
PROBLEM TO BE SOLVED: To secure high printing accuracy by simple assembly work by effectively avoiding a fall in productivity by applying a method of manufacturing a liquid discharge head, a liquid discharge head and a liquid discharge device to a inkjet line printer for example. SOLUTION: The method cuts out a head chip from a semiconductor wafer by a block in which a plurality of chips are connected for mounting. COPYRIGHT: (C)2007,JPO&INPIT
|
