| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal mask for cream solder printing which can prevent a component reflow from being mounted non-conformably due to tilted mounting of the component so as not to allow a void generated during mounting the component reflow to reside at the lower surface of the component, and a circuit substrate and a solder supply method. SOLUTION: The metal mask 10 for cream solder printing comprises openings 12a and 12b for printing a cream solder 22 on a component land 21 of the circuit substrate 20. Thus portions 22a and 22b of the cream solder 22 which are split into two regions respectively are supplied to a component land 21. On the other hand, the circuit substrate 20 comprises the component land 21 where the cream solder 22 is printed, and the cream solder 22 is split into two regions to the component land 21. Consequently, a void generated during mounting the reflow, is drawn through a space 23 between the cream solders 22a and 22b. COPYRIGHT: (C)2007,JPO&INPIT
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