| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC packaging method that is suited for the requirement of environment preservation and attains a stable packaging process with a high yield. SOLUTION: In a packaging method of IC chips, packaging is performed by having a recyclable plastic material as a thermoplastic material and using a conventional plastic injection molding machine. An inclusion is allowed to adhere to the substrate of a chip, and fixed to a lead frame. Bonding is performed, and a wire is hardened. A recyclable plastic material is used as a packaging material for a molding die, and it is heated, pressurized and injected for performing packaging. Then, final tests are done, and obtained products are packaged. COPYRIGHT: (C)2007,JPO&INPIT
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