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发明名称
Method for manufacturing semiconductor package
摘要
申请公布号
KR100649866(B1)
申请公布日期
2006.11.24
申请号
KR20000084889
申请日期
2000.12.29
申请人
发明人
分类号
H01L23/28
主分类号
H01L23/28
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代理人
主权项
地址
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