发明名称 METHOD AND APPARATUS FOR PEELING PLATED GOLD FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To efficiently and finely peel a plated gold film with high accuracy. <P>SOLUTION: This peeling apparatus has an outgoing beam unit 16 which receives a second-harmonic YAG laser beam SHG from a YAG laser oscillator through an optical fiber 18, passes the second-harmonic YAG laser beam SHG emitted from an end face of the optical fiber 18 through an optical lens in the unit, and emits it from an outgoing opening at a head. The peeling method includes irradiating a peeling region (HE) set in each contact (W), from which the plated gold film is to be peeled off, with a condensed oval beam spot SP<SB>SHG</SB>having high ovality. In the peeling region (HE), the plated gold layer 12 is evaporated and removed in the vicinity of the oval beam spot SP<SB>SHG</SB>by laser energy for an instant. The peeling method also includes relatively moving (scanning) the YAG second harmonic laser beam SHG with respect to the contact W to be processed in order to remove most of the plated gold layer 12 in the peeling region (HE). <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006316290(A) 申请公布日期 2006.11.24
申请号 JP20050137175 申请日期 2005.05.10
申请人 MIYACHI TECHNOS CORP 发明人 YAMAZAKI NOBUYUKI
分类号 C23F4/02;B23K26/00;B23K26/06;B23K26/067;B23K26/073;B23K26/36;H01R43/16 主分类号 C23F4/02
代理机构 代理人
主权项
地址