| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet, capable of solving such problems that a pressure-sensitive adhesive sheet given by a conventional technique causes a defect in a semiconductor device which is an adherend, because countermeasures against separating electrification and frictional electrification are insufficient, and a pressure-sensitive adhesive sheet given by a conventional technique by which an antistatic layer is formed loses an antistatic effect, because an antistatic agent contained in the antistatic layer which is cut and exposed in case of dicing is flown out by water blown at high pressure in case of the dicing, and the sheet pollutes an electronic part, because the antistatic agent is scraped up by a dicing blade, and further a pressure-sensitive adhesive sheet given by a conventional technique by which a pressure-sensitive adhesive agent is made to be nonconductive causes a defect in the adherend, because the frictional electrification due to the dicing blade occurs in case of the dicing and the separating electrification occurs in case of separating the adherend. SOLUTION: This pressure-sensitive adhesive sheet is obtained by setting a volume resistivity thereof to 1×10<SP>15</SP>Ωcm or less. The sheet thus obtained produces high antistatic effects on both of the separating electrification and the frictional electrification. COPYRIGHT: (C)2007,JPO&INPIT
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