| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film working for an upper workpiece of a laminating workpiece, furthermore, an innovative working method, and its device for a step of an outer peripheral edge of the laminating workpiece by which production efficiency of an SOI substrate is dramatically improved. SOLUTION: The working device for the step of the outer peripheral edge of the laminating workpiece performs step working for thinning only a board thickness of the outer peripheral edge 1a of an uppermost sheet (silicon wafer 1A) of the laminating workpiece 2. In this case, the working device comprises a table 4 for mounting the workpiece and a driving device therefor, and a grinding stone 15 for grinding. A plane 15a of rotation has an almost right angle to a plane 2a of rotation of the laminating workpiece and a driving device therefor, the grinding stone 15 is rotated at a high speed while rotating the laminating workpiece 2 at a low speed to contact to the laminating workpiece 2, and the grinding stone 15 or the laminating workpiece 2 is made to approach to enlarge a cut bit by bit by the grinding stone 15. Consequently, the outer peripheral edge 1a of the uppermost one sheet of workpiece of the laminating workpiece 2 is worked to make a step by grinding basically in its radial direction. COPYRIGHT: (C)2007,JPO&INPIT
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