SEMICONDUCTOR PACKAGE, STACK PACKAGE USING THE SAME PACKAGE AND METHOD OF FABRICATING THE SAME STACK PACKAGE

摘要

A semiconductor package is provided to eliminate the necessity of varying the structure of a CSP(chip scale package) or using a medium by forming interconnection on the lateral surface of a semiconductor package by a jetting method. A solder ball(400) is formed on the lower part of a PCB(printed circuit board) substrate(100). A semiconductor chip is attached to the upper part of the PCB substrate. The semiconductor chip formed on the PCB substrate is encapsulated by an encapsulation material(300). A first conductive adhesive pattern(500) is formed on the encapsulation material. The solder ball is electrically connected to first conductive adhesive by second conductive adhesive(600) on the lateral surface of the PCB substrate and the encapsulation material. The first conductive adhesive is printable adhesive capable of screen printing. The second conductive adhesive is jettable adhesive capable of jetting.