| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a memory module in which a mechanical strength of a thinned chip is enhanced. <P>SOLUTION: The memory module has memory core chips 10a-10d for storing information; an interface chip 30 for controlling an input and output of data, an interposer chip 40 for transmitting and receiving data between itself and an outside, and an externally connecting terminal 46 provided closer to the interposer chip. With this arrangement, a heat sink 20 is provided closer to the interface chip 30, and the interposer chip 40 has a substrate composed of the same semiconductor material as a memory core chip. Also, a land 41 for retaining the externally connecting terminal, a wiring 44 connected to the externally connecting terminal and an insulating film for insulating the wiring are integrally formed on one face of the interposer chip 40. <P>COPYRIGHT: (C)2007,JPO&INPIT |
