| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer circuit board, suppressing the deformation of a conductor pattern and the displacement of mutual positions, also suppressing inter-layer separation in an outer periphery, manufacturing with high yield the multi-layer circuit board by heating the lamination body of resin films including a thermoplastic resin where the conductor pattern is formed, performing bonding by pressurization, segmenting a prescribed area from a bonded body to obtain the multi-layer circuit board. SOLUTION: In the multi-layer circuit board manufacturing method, a space ks for segmenting is arranged in the respective resin films 10a-10f which constitute the lamination body by enclosing the prescribed area. When heating and pressurizing are performed by thermal press boards Pa, Pb, a frame shape pressurizing board 20 to be abutted in the space ks for segmenting is held between the thermal press boards Pa, Pb and the lamination body, and pressed. COPYRIGHT: (C)2007,JPO&INPIT |
