| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent an interlayer insulating film from coming off by reducing stress by a mold resin. <P>SOLUTION: A semiconductor device comprises an element formed in a chip region on a substrate, a plurality of interlayer insulating films formed on the substrate, wiring formed at least in one of the plurality of interlayer insulating films, a plug that is formed at least in one of the plurality of interlayer insulating films and connects the element to the wire or connects the wiring mutually, and a surface protection film formed on the plurality of interlayer insulating films. Further, the semiconductor device has a resin protection film formed while the surface protection film, which exists at a corner section in the chip region, is covered. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
