<p>A leadframe for fabricating a semiconductor package is provided to reducing a contact area with a runner cull by increasing a penetration area for a slot and a gate hole of a leadframe. A semiconductor package region of a unit is disposed in a matrix form. A lengthy slot(20) is penetrated in a side frame(12) at one side of each semiconductor package region. An oval gate hole(22) is penetrate in a position of one corner of each semiconductor package region. The area of the inlet of the gate hole is increased toward the slot hole to decrease a contact area with the runner cull. The upper end of the slot of a leadframe(10) is further extended to more decrease the contact area with the runner cull.</p>
