| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency module more miniaturizing an LTCC package by constructing the LTCC package as a hierarchical structure. SOLUTION: The LTCC package 1 has a plural layer hierarchical structure that comprises: a first cavity 7 formed on a transmission layer 25; a second cavity 8 formed on a reception layer 26; and a third cavity 17 formed on a control layer 27. The first cavity 7 includes a transmission MIC substrate 6 packaged therein, the second cavity 8 includes a reception MIC substrate 9 and reception MMICs 10, 11 packaged therein, and the third cavity 17 includes control ICs 15, 16 packaged therein. COPYRIGHT: (C)2007,JPO&INPIT |
