| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer treatment apparatus where a hard member is peeled from a brittle member so that the elongation of an adhesive tape is effectively prevented when transferring the brittle member stuck on the hard member on a frame. SOLUTION: A semiconductor wafer W is an object A to be treated which is stuck on a glass plate P with a double-sides adhesive tape S. After the semiconductor wafer is stuck on a dicing tape DT applied on a ring frame RF, the glass plate P is peeled and the semiconductor wafer W is transferred. A reinforcing tape RT is stuck on the outside of the dicing tape DT, thereby preventing the elongation of the dicing tape DT by the reinforcing tape RT in the time when peeling the glass plate P. COPYRIGHT: (C)2007,JPO&INPIT |
