| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for manufacturing a multilayer wiring board in which adhesion strength to a substrate is enhanced while having a fine wiring pattern or conductive vias. SOLUTION: The process for manufacturing a multilayer wiring board 250 comprises a step for filling the recess 130 in a transfer die 120 having a protrusion 140 becoming a conductive via at at least a predetermined position in the recess 130 with insulating resin 160 up to the surface, a step for mounting the recess 130 side of the transfer die 120 oppositely to a substrate 100 having a wiring pattern 110 such that the protrusion 140 abuts against the wiring pattern 110, a step for thermally curing the insulating resin 160, a step for stripping the transfer die 120 and forming a through hole 170 becoming a conductive via, a step for forming a conductive via 200 by filling the through hole 170 with a conductor 180, and a step for forming a wiring layer 210 connected with the conductive via 200. COPYRIGHT: (C)2007,JPO&INPIT |
