| 摘要 |
An electro chemical plating method is provided to wash metal plated at a surface of a contact ring during an electro-chemical plating by supplying an electric current of an anode. After a seed layer is formed on a substrate, it is loaded to be electrically coupled with a contact ring(S1). An electric field is formed between the seed layer on the substrate and an anode(S2). A metal film is formed on the substrate and the substrate supported by the contact ring is extracted from an electrolytic cell and is unloaded to an outside(S3). An electric current of an anode is supplied to the contact ring to wash a metal or a metal oxide plated to a surface of the contact ring, thereby continuously achieving an easy current supply(S4).
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