WAFER POLISHING APPARATUS AND METHOD FOR POLISHING WAFERS

摘要

A wafer polishing apparatus and a method for polishing wafers are provided to reduce polishing equipment and polishing materials by simplifying a wafer polishing process. A polishing pad(11) is formed on an upper surface of a polishing platen(12). A carrier plate(14) is arranged opposite to the polishing pad to rotate a wafer(W) of a holding state and press and rub the wafer to the polishing pad. An abrasive slurry supply unit(16) supplies an abrasive slurry containing an abrasive to a surface of the polishing pad. The abrasive slurry supply unit supplies the abrasive slurries having different average particle diameters of the abrasive to the surface of the polishing pad.