| 摘要 |
PROBLEM TO BE SOLVED: To provide a low price wiring board having excellent heat radiating property which may be manufactured with less number of processes. SOLUTION: In a wiring board, a circuit pattern 3 is formed by laminating a copper foil to an insulating layer 2. A metal material is further laminated with a cold spraying method to the upper part of such circuit pattern 3 to increase thickness in order to form an upper circuit pattern 5. Accordingly, even when a power semiconductor 6 is mounted on this thick upper circuit pattern 5, thermal resistance can be reduced because the heat generated by a loss of the same power semiconductor 6 can be diffused. Therefore, it is possible to constitute a wiring board having excellent heat radiating property and showing remarkably less amount of thermal resistance in comparison with the wiring board of the related art not including the upper circuit pattern 5. COPYRIGHT: (C)2007,JPO&INPIT |
