| 摘要 |
PROBLEM TO BE SOLVED: To prevent degradation in power supply noise removing effect of a decoupling capacitor. SOLUTION: A package is constituted of a first substrate 1 for mounting a semiconductor chip 2, a sidewall plate 6, and a second substrate 7. When a decoupling capacitor 4 is mounted in the package to be connected with the power supply passage of the semiconductor chip 2, the decoupling capacitor 4 is mounted on the lower surface of the second substrate 7. The decoupling capacitor is connected with the semiconductor chip 2 by solder bumps 8 connected with wiring on the lower surface of the second substrate 7 and the power supply passage of the semiconductor chip 2. COPYRIGHT: (C)2007,JPO&INPIT |
