发明名称 METHOD FOR MANUFACTURING MEMORY ELEMENT, AND METHOD FOR MANUFACTURING STORAGE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a memory element having proper characteristics by suppressing variation in characteristics such as the threshold voltage in storing/reading/writing information. <P>SOLUTION: A thin film 2 for memory is sandwiched between a first electrode 1 and a second electrode 4 and the thin film 2 contains a rare earth oxide layer. When a memory element 10 containing any one element selected from Ag, Cu and Zn is manufactured in the thin film 2 for memory or in a layer 3 touching the thin film 2, the thin film 2 for memory is formed by reactive sputtering method. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006319264(A) 申请公布日期 2006.11.24
申请号 JP20050142830 申请日期 2005.05.16
申请人 SONY CORP 发明人 OBA KAZUHIRO;HIGO YUTAKA;KUBO SHINYA;NARISAWA KOSUKE
分类号 H01L27/10 主分类号 H01L27/10
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