| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered circuit board which raises a bonding reliability between metal circuits which are located between insulating substrates, and the insulating substrates, and doesn't cause any breakage in the insulating substrates. SOLUTION: In the multilayered circuit board constituted by alternately laminating a plurality of insulating substrates 1 and a plurality of metal circuits 2 consisting of a circuit-like metal, the metal circuit 2 located between the insulating substrates 1 upward and downward adjacent thereto is constituted by bonding through a bonding material 4 an upper metal circuit 2-1 which is bonded to a bottom surface of an upper insulating substrate 1, and a lower metal circuit 2-2 which is bonded to a top face of a lower insulating substrate 1 and has a circuit profile in which a plane seeing profile corresponds to the upper metal circuit 2-1. COPYRIGHT: (C)2007,JPO&INPIT
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