WINDING MECHANISM FOR SOLDER WIRE MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a winding mechanism for a solder wire manufacturing device capable of winding a solder wire around a spool in a traversing manner while preventing the solder wire from being damaged or entangled. SOLUTION: A conductive plate 5 is arranged below a die of a longitudinal extrusion press machine 1, and conduction is performed between the die and the conductive plate when a solder wire 4 which is extruded from the die and naturally dropped is brought into contact with the conductive plate. A take-up device 7 has a winding motor 8 to turn a spool 14 and a traverse motor 9 to traverse the spool 14 via a traversing ball screw 11, and winds the solder wire 4 around the spool 14. A detection circuit and a control circuit are provided in a control box 6. The detection circuit detects the conduction time between the die and the conductive plate 5 which is changed corresponding to the winding diameter of the spool 14, and the control circuit is capable of adjusting the rotational speed of the winding motor 8 according to the result of detection. COPYRIGHT: (C)2007,JPO&INPIT