发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a cylindrical capacitive element ensuring a large capacitance with a small cell area. <P>SOLUTION: This semiconductor device 10 comprises the capacitive element having: a first capacitive element portion 44 comprising a first electrode film 39, a capacitive insulating film 42, and an upper electrode 43 successively formed within the cylindrical hole 38, in a cylindrical hole forming insulating film 36 formed in the upper portion of a semiconductor substrate 11; and a second capacitive element portion 45 formed continuously to the first capacitive element portion 44 in the upper portion of the cylindrical hole forming insulating film 36 and having a second electrode film 40, the capacitive insulating film 42, and the upper electrode 43. The second electrode film 40 is formed on the first electrode film 39 continuously to the first electrode film 39, and has a thickness larger than that of the first electrode film 39. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006319121(A) 申请公布日期 2006.11.24
申请号 JP20050140079 申请日期 2005.05.12
申请人 ELPIDA MEMORY INC 发明人 TAKAISHI YOSHIHIRO
分类号 H01L21/8242;H01L21/822;H01L27/04;H01L27/108 主分类号 H01L21/8242
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