| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive tape which is finally removed in a method for manufacturing a semiconductor device, which is suitable for manufacturing a semiconductor device that has a standoff, namely a part of a conductor projecting from a sealing resin, and which is sufficient peeling property even after the treatment of plasma processing. <P>SOLUTION: The adhesive film is used for the method of manufacturing a semiconductor device. The method includes (a) a step to embed at least a part of a conductor in the adhesive film and form a conductor adhered to the adhesive film, (b) a step to mount a semiconductor chip to the conductor, (c) a step to connect the semiconductor chip and the conductor, (d) a step to seal the semiconductor chip by a sealing resin, and (e) a step to remove the adhesive film. The adhesive film is provided with a thermosetting adhesive layer and a heat resistance substrate layer, and the thermosetting adhesive layer contains a component which has a peeling property from the sealing resin and of which molecular weight is 50,000 or less. <P>COPYRIGHT: (C)2007,JPO&INPIT |
