发明名称 FORMING METHOD OF STACK LAYER OF ELECTRONIC DEVICE AND MANUFACTURING METHOD ADOPTING THE SAME
摘要 A method for forming a stack layer of an electronic device and a method for manufacturing a field emission device using the same are provided to an obtain a desired structure using a simple process by using a photomask for performing multi-patterning. At least one target material layer is coated on a substrate of the electronic material(1). A positive photoresist having a polymer is coated on the substrate, in which the polymer comprises at least 50 mole % of monomers. The mask layer is firstly baked at a first temperature(2). The mask layer is exposed to light with a predetermined pattern(3). The mask layer is secondarily baked at a second temperature(4). The mask layer is developed to form an etch window in the mask layer(5). The target material layer is etched through the etch window(6). The mask layer is removed(7), and the exposing to the developing steps are repeated at twice.
申请公布号 KR20060119149(A) 申请公布日期 2006.11.24
申请号 KR20050041759 申请日期 2005.05.18
申请人 SAMSUNG SDI CO., LTD.;E.I. DU PONT DE NEMOURS AND COMPANY 发明人 PARK, SHANG HYEUN;LEE, HANG WOO;KIM, YOUNG HWAN
分类号 H01J1/30 主分类号 H01J1/30
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