| 摘要 |
A rectangular frame-shaped sealing plane (11a) for sealing a side wall is formed on a periphery part of a front board (11) of an FED. On the sealing plane (11a), an indium layer (32) is formed via a base layer (31). At the four corner parts of the indium layer (32), electrodes (34) for carrying electricity are connected, respectively. The width of the indium layer (32) gradually narrows as it goes closer to the adjacent corner part from almost center of each side part.
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