| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board capable of forming a multilayer double-sided interconnection board 20 at low costs. SOLUTION: There are provided a process for forming a multilayer wiring structure 10 in which first and connection terminals 16b, 16t are provided at the side of a temporary substrate 13 and a side opposite to the temporary substrate 13, respectively, on the surface of the temporary substrate 13; and a process for removing the temporary substrate 13 to expose the first connection terminal 16b to the rear of the multilayer wiring structure 10. The multilayer wiring structure 10 is formed by using a droplet discharge method. Preferably, the second and first connection terminals 16t, 16b are composed of an Au material. COPYRIGHT: (C)2007,JPO&INPIT |
