摘要 |
PROBLEM TO BE SOLVED: To provide a white prepreg that can produce substrate causing extremely reduced discoloration with UV ray or heat because the conventional white laminating plate for printed wire board has the problem that the thermally curable resin part is discolored with heat and lower the reflectivity, further the substrate on which LED chip is mounted is deteriorated by UV ray and discolored, and obtains high board thickness accuracy causing no liquid spill at the sealing step of the chip LED. SOLUTION: The base material made of glass fiber sheet is impregnated with the resin composition (E) including, as essential components, (A) an epoxy resin including an alicyclic epoxy resin (A1), (B) glycidyl (meth)acrylate polymer, (C) white pigment, and (D) a curing agent and dried. Further, the white laminating plate is produced by thermally press-forming one or plural sheets of the white prepregs. COPYRIGHT: (C)2007,JPO&INPIT |