| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic joining apparatus for semiconductor parts using ultrasonic vibration in which weight of a vibration body including an ultrasonic horn 12 is reduced, which improves positioning accuracy and suppresses joining time by facilitating positioning control. SOLUTION: This ultrasonic joining apparatus is provided with the ultrasonic horn 12 set to the length of one wavelength of the frequency of ultrasonic waves in advance, and having maximum vibration amplitude points at both ends and at a central part in the longitudinal direction; a joining action part 12b provided to the maximum vibration amplitude point at the central part in the longitudinal direction of the ultrasonic horn 12; an ultrasonic vibrator 32 laterally vibrating the ultrasonic horn 12; a support member 26 detachably fixing the ultrasonic horn 12; and a pressurizing means pressurizing the ultrasonic horn 12. Insertion holes 31 are formed at two nodal points of the ultrasonic horn 12, and fixing bolts 30 are fastened at the sectional center of the ultrasonic horn 12 at the center of the insertion holes 31 to support the ultrasonic horn 12. COPYRIGHT: (C)2007,JPO&INPIT |
