FREQUENCY ADJUSTMENT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING FREQUENCY ADJUSTMENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a frequency adjustment device capable of being assembled with a semiconductor package in a space-saving way and to provide the semiconductor package assembled with the frequency adjustment device. SOLUTION: The frequency adjustment device 10 located on a high frequency signal input transmission line 104 of the semiconductor package 100 including: a resistor 14 for connecting a first conductor 15 and a second conductor 16 formed on a substrate 17 and through which a high frequency signal is transmitted; a dielectric 11 located on an end 15 of the first conductor; and an electrode 12 arranged on the dielectric 11 and connected to the second conductor, is configured to form a filter circuit by using the resistor 14 and the dielectric 11. COPYRIGHT: (C)2007,JPO&INPIT