SUBSTRATE HEAT TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus capable of performing uniform heat treatment in the plane of a substrate by correcting deflection of the substrate by sucking. SOLUTION: By exhausting a gas in a minute space ms by way of an exhaust hole 27, a negative pressure occurs in the minute space ms to suck a substrate W surface to a bake plate 1 side. The deflection is corrected by a negative pressure even if there is warpage on the substrate W, and the lower surface of the substrate W abuts with a ball 19 with an appropriate distance kept from the upper surface of the bake plate 1. So, a uniform heat treatment is allowed in the plane of the substrate W. COPYRIGHT: (C)2007,JPO&INPIT