| 摘要 |
A multichip light emitting diode package is provided. The multichip light emitting diode (LED) package includes a substrate having a non-plane surface including a plurality of sectioned-surfaces, a plurality of light emitting diode chips and a transparent molding material. Each of the light emitting diode chips is disposed on one of the sectioned-surfaces of the substrate. The transparent molding material is formed on the substrate for encapsulating the light emitting diode chips. By way of the configurations of the non-plane surface of the substrate and the transparent molding material, the multichip light emitting diode package emits converging light in accordance with the Snell's law. The purposes of evenly mixing emitting lights and improving brightness are achieved. The present invention can provide a single color, multi-color or full-color multichip LED package with uniform brightness and hues.
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