| 摘要 |
A device and method for improving the uniformity of resist layers. The device includes a rotatable substrate support, a resist supply, a control fluid supply and a controller. In operation, the placement of a control fluid is varied locally to promote a localized change in a rate of evaporation of the deposited resist to form a substantially uniform thickness of the deposited resist layer. The control fluid supply includes a pressure source, a conduit and a discharge orifice such that control fluid impinges onto a localized portion of the deposited resist such that thickness variations that would otherwise occur across portions of the deposited resist are avoided or minimized.
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