发明名称 IMPEDANCE CONTROLLED VIA STRUCTURE
摘要 <p>In one embodiment, a via structure for a printed circuit board is provided which includes a signal via and an elongated signal conductor strip in electrical connection with the signal via. The elongated signal conductor strip is adjacent to a ground conductor and extends from the conductive pad substantially to the ground conductor. The elongated signal conductor strip includes a portion extending laterally outward, which may be configured to have a capacitance so as to establish an impedance for the via structure.</p>
申请公布号 WO2006124864(A1) 申请公布日期 2006.11.23
申请号 WO2006US18870 申请日期 2006.05.15
申请人 TERADYNE, INC.;BEHZIZ, ARASH 发明人 BEHZIZ, ARASH
分类号 H05K1/02 主分类号 H05K1/02
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