| 摘要 |
A laser component having an integrated cooling element is disclosed herein and includes a multiple layer heatsink body having a first isolation layer, at least a second isolation layer, and a micro-channel body positioned between the first and second isolation layers, the micro-channel body having one or more micro-channels formed therein in communication with a first passage and at least a second passage, at least one cathode lead formed on a first surface of the heatsink body, at least one anode lead formed on a first surface of the heatsink body, a coupling surface formed on a second surface of the heatsink body, at least one conduit traversing the heatsink body, the conduit in electrical communication with the anode lead and the coupling surface, a coolant source in fluid communication with the micro-channels formed in the micro-channel body through the first and second passages, at least one operational element positioned on the first surface of the heatsink body in communication with the cathode lead and anode lead.
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