| 发明名称 |
USE OF AN ADHESIVE FILM FOR IMPLANTING ELECTRIC MODULES INTO A CARD BODY |
| 摘要 |
<p>The invention relates to the use of an adhesive film for bonding a chip module in a card body. Said adhesive film comprises at least two adhesive layers (i) and (ii), which differ chemically from one another.</p> |
| 申请公布号 |
KR20060118408(A) |
申请公布日期 |
2006.11.23 |
| 申请号 |
KR20067003564 |
申请日期 |
2006.02.21 |
| 申请人 |
TESA AG |
发明人 |
BARGMANN RENKE;HUSEMANN MARC |
| 分类号 |
C09J7/02;C09J7/00;G06K19/077 |
主分类号 |
C09J7/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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