Chip structure with arrangement of side pads

摘要

A chip structure includes a substrate with at least an arrangement of side pads on an active surface of the substrate and adjacent to one side of the active surface. The arrangement of side pads includes an outer pad row, a middle pad row and an inner pad row disposed along the extension direction of the side. The middle pad row is further away from the side than the outer pad row. The inner pad row is further away from the side than the middle pad row. Pads of the middle pad row and pads of the inner pad row are staggered. One non-signal pad of the middle pad row is located between two adjacent signal pads of the inner pad row, and one non-signal pad of the inner pad row is located between two adjacent signal pads of the middle pad row.