POLISHING SLURRY

摘要

The present invention discloses a polishing slurry, wherein, the said polishing slurry contains a carrier and functional-alumina grains. The present polishing slurry which contains functional - alumina grains has good stability, this polishing slurry can reduce the rate of defect , improve the quality of the substrate surface, lessen the total metal loss rate and widen the variation range of the technological parameters.