WAFER INSPECTING SHEET-LIKE PROBE AND APPLICATION THEREOF

摘要

A wafer inspecting sheet-like probe which can surely achieve an excellent electrical connection status even with a wafer wherein a pitch of electrodes to be inspected is extremely small, and application of such probe. The wafer inspecting sheet-like probe is provided with an insulating sheet having a plurality of through holes extending in the thickness direction by following a pattern that corresponds to a pattern of the electrode to be inspected in the entire or a part of an integrated circuit formed on the wafer; and an electrode structure arranged to protrude from both planes of the insulating sheet in each of the through holes on the insulating sheet. The electrode structure is provided by connecting a front plane electrode section, which is exposed on the front plane of the insulating sheet and has a diameter larger than that of the front plane opening of the through hole on the insulating sheet, with a rear plane electrode section, which is exposed on the rear plane of the insulating sheet and has a diameter larger than that of the rear plane opening of the through hole on the insulating sheet, by a short-circuiting section inserted into the through hole of the insulating sheet, and the electrode structure is movable in the thickness direction of the insulating sheet.