| 摘要 |
Methods and apparatuses for encapsulating microelectronic devices are disclosed herein. In one embodiment, a method for encapsulating a microelectronic device having a microelectronic die attached to a substrate includes positioning the microelectronic die in a molding cavity having a first volume. The method also includes introducing a molding compound into the molding cavity to at least partially encapsulate the die. The method further includes reducing the volume of the molding cavity from the first volume to a second volume less than the first volume while the microelectronic die and the molding compound are in the molding cavity.
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