发明名称 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
摘要 <p>A positive resist composition from which a resist pattern of a satisfactory shape is obtained. It is a positive resist composition obtained by dissolving in an organic solvent (S) a resin ingredient (A) whose alkali solubility increases by the action of an acid and an acid generator ingredient (B) which generates an acid upon irradiation with a radiation, the resin ingredient (A) comprising a copolymer (A1) which comprises a constituent unit (a1) having an acetal-type protective group, a constituent unit (a2) represented by the general formula (a2-1) and derived from an acrylic ester having a lactone-containing polycyclic group, and a constituent unit (a3) derived from an acrylic ester having a polar-group-containing aliphatic hydrocarbon group. [Chemical formula 1] (a2-1) [In the formula, R represents hydrogen, fluorine, lower alkyl, or lower fluoroalkyl; R' represents hydrogen, lower alkyl, or C<SUB>1-5</SUB> alkoxy; and m is 0 or 1.]</p>
申请公布号 WO2006123487(A1) 申请公布日期 2006.11.23
申请号 WO2006JP307486 申请日期 2006.04.07
申请人 TOKYO OHKA KOGYO CO., LTD.;KINOSHITA, YOHEI;IRIE, MAKIKO;OHKUBO, WAKI;NAKAGAWA, YUSUKE;HIDESAKA, SHINICHI 发明人 KINOSHITA, YOHEI;IRIE, MAKIKO;OHKUBO, WAKI;NAKAGAWA, YUSUKE;HIDESAKA, SHINICHI
分类号 G03F7/039;C08F220/10;G03F7/004;H01L21/027 主分类号 G03F7/039
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