发明名称 Cooling system for a substrate
摘要 The present invention relates to a cooling system, the cooling system having a nozzle which receives coolant from a reservoir and which faces a substrate. The nozzle may be opened and closed by a thermally responsive valve allowing the coolant to be automatically metered to the substrate, thus controlling the spatial distribution of the coolant that is applied to the substrate. This approach allows hotter areas of the substrate to receive more coolant, thus eliminating nonuniformities in the thermal profile of the substrate.
申请公布号 US2006262503(A1) 申请公布日期 2006.11.23
申请号 US20050315792 申请日期 2005.12.22
申请人 BEVAN MATTHEW G;REBELLO KEITH J;ADAMS ALAN;SZCZEPANOWSKI RAFAL P 发明人 BEVAN MATTHEW G.;REBELLO KEITH J.;ADAMS ALAN;SZCZEPANOWSKI RAFAL P.
分类号 H05K7/20 主分类号 H05K7/20
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