| 发明名称 |
THIN BOND-LINE SILICONE ADHESIVE COMPOSITION AND METHOD FOR PREPARING THE SAME |
| 摘要 |
<p>Thermal interface compositions (20) contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials (20) and the corresponding mating surfaces.</p> |
| 申请公布号 |
KR20060118417(A) |
申请公布日期 |
2006.11.23 |
| 申请号 |
KR20067003715 |
申请日期 |
2006.02.23 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
TONAPI SANDEEP SHRIKANT;ZOHNG HONG;SCHATTENMANN FLORIAN JOHANNES;DAVID JENNIFER LYNN;SAVILLE KIMBERLY MARIE;GOWDA ARUN VIRUPAKSHA;ELSER DAVID RICHARD;PRABHAKUMAR ANANTH |
| 分类号 |
C09J183/04;C08L83/04;C09J183/00;H01L23/373;H01L23/42 |
主分类号 |
C09J183/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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