发明名称 |
Method of forming fine patterns |
摘要 |
It is disclosed a method of forming fine patterns comprising repeating plural times the following course of steps: covering a substrate having thereon photoresist patterns with an over-coating agent for forming fine patterns, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between the adjacent photoresist patterns is lessened by the resulting thermal shrinking action, and removing the over-coating agent. The invention provides a method of forming fine patterns which has high ability to control pattern dimensions and provide fine patterns that have a satisfactory profile and satisfy the characteristics required of semiconductor devices, even in the case of employing a substrate having thick-film photoresist patterns in a thickness of about 1.0 mum or more.
|
申请公布号 |
US2006263728(A1) |
申请公布日期 |
2006.11.23 |
申请号 |
US20060493538 |
申请日期 |
2006.07.27 |
申请人 |
SHINBORI HIROSHI;SUGETA YOSHIKI;KANEKO FUMITAKE;TACHIKAWA TOSHIKAZU |
发明人 |
SHINBORI HIROSHI;SUGETA YOSHIKI;KANEKO FUMITAKE;TACHIKAWA TOSHIKAZU |
分类号 |
G03C5/00;G03F7/00;G03F7/40;H01L21/027 |
主分类号 |
G03C5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|