发明名称 |
Semiconductor package and stack arrangement thereof |
摘要 |
A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor package and a second portion exposed from the lower surface of the semiconductor package. Both of the first portion and the second portion of each lead can be utilized for making external electrical connection.
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申请公布号 |
US2006261453(A1) |
申请公布日期 |
2006.11.23 |
申请号 |
US20060416206 |
申请日期 |
2006.05.03 |
申请人 |
LEE YONGGILL;PARK SANGBAE |
发明人 |
LEE YONGGILL;PARK SANGBAE |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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