| 摘要 |
A light emitting diode package having a unified heat sink plate and a multi-package module are provided. The light emitting diode package comprises a chip bonding pad on which a light emitting diode chip is to be mounted, at least one lead electrically connected to the light emitting diode chip and insulated from the chip bonding pad, an insulation body formed around the chip bonding pad, fixing the lead and having a light emitting window through which light emitted from the light emitting diode chip passes, a heat sink plate integrated into the chip bonding pad, protruding from an outside of the insulation body and dissipating operating heat of the light emitting diode chip, and a plurality of division holes which are formed between the chip bonding pad and the heat sink plate and have a stepped shape and into which a resin is injected when the insulation body is formed, wherein the heat sink plate occupies more than a fourth part of the entire outer circumference of the insulation body. Through the above structure, since there is no worry about moisture-absorption and exfoliation, the heat sink plate can be formed to have a large area so that a heat dissipation effect is improved and a plurality of light emitting diode packages are arranged on one large-area heat sink plate and can be modularized. |
