发明名称 Copper electrolytic process using cation permeable barrier
摘要 Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
申请公布号 US2006260946(A1) 申请公布日期 2006.11.23
申请号 US20060414535 申请日期 2006.04.28
申请人 SEMITOOL, INC. 发明人 BASKARAN RAJESH;BATZ ROBERT W.JR.;KIM BIOH;RITZDORF TOM L.;KLOCKE JOHN L.;HANSON KYLE M.
分类号 C25D5/02 主分类号 C25D5/02
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