发明名称 |
COPPER-NICKEL-SILICON TWO PHASE QUENCH SUBSTRATE |
摘要 |
A copper- nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide pass. The microstructure is substantially homogenous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates. |
申请公布号 |
KR20060118411(A) |
申请公布日期 |
2006.11.23 |
申请号 |
KR20067003590 |
申请日期 |
2004.08.13 |
申请人 |
METGLAS, INC. |
发明人 |
MYOJIN SHINYA;BYE RICHARD L.;DECRISTOFARO NICHOLAS J.;MILLURE DAVID W.;SCHUSTER GARY B. A. |
分类号 |
C22C9/06;B21J1/04;B21J5/00;B22D11/06;B22D21/00;C22C;C22F1/00;C22F1/08 |
主分类号 |
C22C9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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