| 摘要 |
A thermal management system ( 300 ) includes a first heat transfer body ( 330 ) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface ( 315 a) of a circuit die ( 315 ) due to a integrated circuit hot-spot ( 310 ). A contact ( 320, 321 962 a, 962 b, 970 a, 970 b or 950 ) defines a thermal conduction path for the opposing flux. A second heat transfer body ( 350 ) is in a heat transport relationship with the first heat transfer boy ( 330 ) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body ( 330 ), such as a thermoelectric cooler, may be provided at the hot-spot ( 310 ), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body ( 350 ), such as a heat spreader.
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